Literature Study on Thermal Interface Materials

This set provides supplementary data for the following paper: This dataset contains calculated thermal resistance values (Rth) for various Thermal Interface Materials (TIMs) used in graphics card assemblies. Calculations are based on realistic geometries, power consumption values, and thermal conductivities typical for high-performance GPUs. The effects of a proposed metallurgical bonding layer formed via Al-Cu compound casting are also evaluated. Performance comparisons are made for different TIM configurations (thermal pastes, pads, solder, compound joints) across high-end and mid-range GPU models (e.g., NVIDIA RTX 4090 and 4070). Temperature reductions are quantified as a function of interface quality and thermal power dissipation.

Daten und Ressourcen

Cite this as

Timon Steinhoff, Christian Klose (2025). Literature Study on Thermal Interface Materials [Data set]. LUIS. https://doi.org/10.25835/hpg36of2
Retrieved: 13:26 22 Jul 2026 (UTC)

Zusätzliche Informationen

Feld Wert
Quelle Calculations by authors; based on data from technical datasheets [3–6], scientific literature [1,2], and public GPU specifications.
Autor Timon Steinhoff, Christian Klose
Verantwortlicher Timon Steinhoff
Zuletzt aktualisiert März 9, 2026, 08:18 (UTC)
Erstellt Mai 23, 2025, 16:07 (UTC)
Lizenz Creative Commons Attribution 4.0 International
Dataset Size 288.6 KByte
Funding Deutsche Forschungsgemeinschaft (DFG), Project-ID 394563137 – SFB 1368
Main Publication